发明名称 FILM FORMATION METHOD, FILM-FORMING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a film formation method and a film-forming apparatus capable of efficiently removing an organic solvent constituent in source gas and suppressing the decomposition of an organic metal compound included in the source gas. SOLUTION: The film formation method includes: a process for generating the source gas by vaporizing a solution where the metal organic compound is dissolved into an organic medium; and a process for introducing the source gas into a reaction chamber 10 with a substrate 1 placed therein. Before the source gas reaches the substrate 1, a catalyst including a noble metal is brought into contact with the source gas and oxygen gas, the organic solvent is decomposed, and a film 2 including metal is formed on the substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009129963(A) 申请公布日期 2009.06.11
申请号 JP20070300400 申请日期 2007.11.20
申请人 FUJITSU MICROELECTRONICS LTD 发明人 NAKABAYASHI MASAAKI
分类号 H01L21/316;C23C16/44;H01L21/31 主分类号 H01L21/316
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