发明名称 |
FILM FORMATION METHOD, FILM-FORMING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a film formation method and a film-forming apparatus capable of efficiently removing an organic solvent constituent in source gas and suppressing the decomposition of an organic metal compound included in the source gas. SOLUTION: The film formation method includes: a process for generating the source gas by vaporizing a solution where the metal organic compound is dissolved into an organic medium; and a process for introducing the source gas into a reaction chamber 10 with a substrate 1 placed therein. Before the source gas reaches the substrate 1, a catalyst including a noble metal is brought into contact with the source gas and oxygen gas, the organic solvent is decomposed, and a film 2 including metal is formed on the substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009129963(A) |
申请公布日期 |
2009.06.11 |
申请号 |
JP20070300400 |
申请日期 |
2007.11.20 |
申请人 |
FUJITSU MICROELECTRONICS LTD |
发明人 |
NAKABAYASHI MASAAKI |
分类号 |
H01L21/316;C23C16/44;H01L21/31 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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