发明名称 |
REFLOW PROCESSING APPARATUS AND REFLOW PROCESSING METHOD |
摘要 |
<p>A reflow treating apparatus and a reflow treating method are provided to prevent density variation of a solvent of a reflow treating part in transferring a substrate by installing a unit for preventing solvent density variation in a top end and a bottom end of a bottom part of a nozzle unit. A reflow treating apparatus(100) includes a transfer passage(T) and a transfer unit(8,9). A substrate(G) is vertically transferred in the reflow treating apparatus. The transfer unit transfers the substrate according to the transfer passage. The substrate passes through a transfer space(3) including the transfer passage. A nozzle unit(10) includes a solvent inlet nozzle(6) and a solvent outlet nozzle(7). The nozzle unit forms a reflow treating part(P) by controlling the solvent through the solvent inlet nozzle and the solvent outlet nozzle.</p> |
申请公布号 |
KR20090060181(A) |
申请公布日期 |
2009.06.11 |
申请号 |
KR20080122859 |
申请日期 |
2008.12.05 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
ASOU YUTAKA;UEDA TOSHIHIKO |
分类号 |
H01L21/027;H01L21/324;H01L29/786 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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