发明名称 REFLOW PROCESSING APPARATUS AND REFLOW PROCESSING METHOD
摘要 <p>A reflow treating apparatus and a reflow treating method are provided to prevent density variation of a solvent of a reflow treating part in transferring a substrate by installing a unit for preventing solvent density variation in a top end and a bottom end of a bottom part of a nozzle unit. A reflow treating apparatus(100) includes a transfer passage(T) and a transfer unit(8,9). A substrate(G) is vertically transferred in the reflow treating apparatus. The transfer unit transfers the substrate according to the transfer passage. The substrate passes through a transfer space(3) including the transfer passage. A nozzle unit(10) includes a solvent inlet nozzle(6) and a solvent outlet nozzle(7). The nozzle unit forms a reflow treating part(P) by controlling the solvent through the solvent inlet nozzle and the solvent outlet nozzle.</p>
申请公布号 KR20090060181(A) 申请公布日期 2009.06.11
申请号 KR20080122859 申请日期 2008.12.05
申请人 TOKYO ELECTRON LIMITED 发明人 ASOU YUTAKA;UEDA TOSHIHIKO
分类号 H01L21/027;H01L21/324;H01L29/786 主分类号 H01L21/027
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