| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem in a method of bonding and a bonded structure using a conventional material of a metal nano paste, that a porous bonded structure is formed by voids generated in a bonded part with heating and the bonded strength becomes low, consequently giving low credibility, associated with the breakage of a bonded part caused by thermal stress or the like. <P>SOLUTION: The bonded strength is increased by disposing a lamination of a bonding material formed by a metal nano paste material on an electrode of a circuit forming body, preliminary disposing a resin for assisting the reinforcement of bonding strength between electrodes of an electronic component or the circuit forming body, and constituting the bonded structure by integrally heating so that the resin can penetrate into voids generated inside the lamination body of the bonding material while melting and curing the resin all over the surface of the electronic component. <P>COPYRIGHT: (C)2009,JPO&INPIT |
