| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip mounting process that saves testing time of memory chip packages and also reduce total production time. <P>SOLUTION: The chip mounting process includes the steps of: forming a chip group on a unit substrate of a substrate strip; making a plurality of circumscribing pads on the bonding surface of each unit substrate; electrically connecting the chip group to a corresponding unit substrate; sealing the chip group in a sealed body on the substrate strip; and carrying out a PMC step to cure the sealed body and burn in test and high temperature test at the same time. A plurality of probe terminals of burn-in probe plate are electrically connected to the circumscribing pads. The substrate strip has a plurality of wiring removal regions and the circumscribing pads of different unit substrates are electrically isolated before the PMC step. In the last stage, the package is diced to isolate unit substrates equipped with the sealed chip group and the circumscribing pads into unit packages. With this process, testing time of memory chip packages and total production time can be largely reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT |
