| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tacky adhesive sheet for semiconductor wafer polishing which can be smoothly separated upon heating from any one direction, and a method for working an adherend bonded to each other with the tacky adhesive sheet, and a device for separating the tacky adhesive sheet. <P>SOLUTION: A tacky adhesive sheet 5 in this invention comprises a resin laminate in which a higher heat shrinkable base material layer 1 with relatively larger heat shrinkage and a lower heat shrinkable base material layer 3 with relatively lower heat shrinkage are bonded through an adhesives layer 2. In the higher heat shrinkable base material layer 1, a ratio (A:B) of a shrinkage [A (%)] in a main shrinkage direction and a shrinkage [B (%)] in a direction orthogonal to the main shrinkage direction is 1:1 to 10:1. Upon heating from any one direction, the resin laminate is warped to the higher heat shrinkable base material layer side, and, upon further heating, the resin laminate is spontaneously wound to one direction from one end to form one cylindrical roll. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
