| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for chip protection that can prevent a wafer from being broken and improve efficiency of a sticking operation. SOLUTION: Disclosed is the film 2 for chip protection stuck on a reverse surface 101 of a circuit formation surface of the wafer 100, the film 2 for chip protection being characterized in that the tensile fracture strength of the film 2 for chip protection is≤1.0 N and the tensile elongation of the film for chip protection at break is≤300%. For example, the film for chip protection is formed by sticking a protective film formation layer formed on a release sheet on the wafer and then transferring it. COPYRIGHT: (C)2009,JPO&INPIT
|
