| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for rupturing an adhesive film fitted on the rear of a wafer preventing an adhesion on the surfaces of devices of the fragments of the adhesive film when the adhesive film is ruptured along each device by extending a dicing tape with the adhesive film stuck thereto, and also to provide the adhesive film. SOLUTION: In the method for rupturing the adhesive film fitted on the rear of the wafer, the adhesive film forming a plurality of streets on its surface in a latticed shape while being fitted on the rear of the wafer forming the devices in a plurality of regions partitioned by a plurality of the streets and having an outside diameter larger than the outside diameter of the water is ruptured along the devices under the state sticking the adhesive film on the surface of the dicing tape fitted to an annular frame. In the method for rupturing the adhesive film, a plurality of radial split grooves are formed to the outer peripheral section of the adhesive film, and the adhesive film is ruptured along the devices by extending the dicing tape while a region protruded from the outer periphery of the wafer on the outer peripheral section of the adhesive film is separated along a plurality of the radial split grooves. COPYRIGHT: (C)2009,JPO&INPIT
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