发明名称 FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC APPLIANCE, AND MANUFACTURING METHOD OF SAME FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a flexible printed wiring board which improves its flexibility by thinning it, and obtain an electronic appliance using it, and reduction of the number of its manufacturing processes and further, obtain its manufacturing method which can create it without requiring any high positional accuracy. SOLUTION: The flexible printed wiring board has a wiring layer which has a base film and a signal conductor layer laminated on the base film and having formed conductor patterns, a conductor layer which has an insulating adhesive layer covering the wiring layer and a shield conductor layer laminated on the wiring layer via the insulating adhesive layer, and a conductor protrusion which is formed on the signal conductor layer and so passes through the insulating adhesive layer as to be connected electrically with the shield conductor layer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009130198(A) 申请公布日期 2009.06.11
申请号 JP20070304722 申请日期 2007.11.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 TABATA TETSURO;KOYAMA MASATO;OKITA TAIDO
分类号 H05K1/02 主分类号 H05K1/02
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