发明名称 SURFACE TREATMENT APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To suppress a loss of a treatment gas by improving treatment efficiency in surface treatment such as ashing or etching. SOLUTION: A surface treatment apparatus 10 is provided with a pair (plurality) of jetting portions 44. The jetting portions 44 are disposed so as to be separated from each other in different directions with respect to a treatment position P1, viewed from a direction perpendicular to a workpiece 90 to be treated. Treatment gases from the jetting portions 44 are allowed to collide with each other on the treatment position P1 and the vicinity thereof. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009129999(A) 申请公布日期 2009.06.11
申请号 JP20070300940 申请日期 2007.11.20
申请人 SEKISUI CHEM CO LTD 发明人 NISHIKAWA OSAMU;NOGAMI MITSUHIDE;HASEGAWA TAIRA
分类号 H01L21/3065 主分类号 H01L21/3065
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