发明名称 DIE FOR MOLDING RESIN AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a die that can heat, uniformly and in a short time, a resin overlaid on a die face plate to a heat treatment temperature, perform the heat treatment while keeping it within the range of a narrow heat treatment temperature with good accuracy, and promptly cool the molded body after the completion of the heat treatment, and to provide a molding method. SOLUTION: A molding die for a resin to be subjected to heat treatment includes a face plate on which a resin is overlaid, a structural member for supporting the face plate and a temperature controlling means for the face plate. The temperature controlling means is composed of a pipe arranged in the rear surface of the face plate, a heating medium and a cooling medium to be passed through the pipe, a heating medium tank and a cooling medium tank each holding the heating medium and the cooling medium, and a changeover valve for changing the flow of the heating medium and the cooling medium. The heating medium is flown to the pipe from the heating medium tank to perform the heating, after the heat treatment the medium to be flown into the pipe is changed by changeover of the changeover valve, and the cooling is performed by flowing the cooling medium into the pipe from the cooling medium tank. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009125976(A) 申请公布日期 2009.06.11
申请号 JP20070300295 申请日期 2007.11.20
申请人 NIPPON YAKIN KOGYO CO LTD 发明人 KOMURO MAKOTO
分类号 B29C33/04;B29C39/38;B29C43/52;B29C70/06 主分类号 B29C33/04
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