发明名称 SYSTEM AND METHOD FOR DUAL-SIDED SPUTTER ETCH OF SUBSTRATES
摘要 A system is provided for etching patterned media disks. A movable non-contact electrode is utilized to perform sputter etch. The electrode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The material to be etched may be metal, e.g., Co/Pt/Cr or similar metals. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched. An isolation valve is disposed between the two chambers and the disk carrier moves the disks between the chambers. The carrier may be a linear drive carrier, using, e.g., magnetized wheels and linear motors.
申请公布号 US2009145881(A1) 申请公布日期 2009.06.11
申请号 US20080329447 申请日期 2008.12.05
申请人 INTEVAC, INC. 发明人 BARNES MICHAEL S.;BLUCK TERRY
分类号 B44C1/22;C23F1/08 主分类号 B44C1/22
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