| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for sealing optical semiconductors, which can be used for sealing light-emitting elements emitting light having a short wavelength in a high output and required in recent years, gives cured products free from surface tackiness, and is excellent in thermal yellowing resistance and heat impact-resistant reliability. SOLUTION: Provided is the thermosetting resin composition for sealing the optical semiconductors, comprising 10 to 60 wt.% of the following component (A) and 90 to 40 wt.% of the component (B): (A) an alicyclic epoxy resin having two or more epoxy groups and (B) a carboxyl group-containing polysiloxane having two or more cyclohexyl rings having a carboxyl group on the ring. COPYRIGHT: (C)2009,JPO&INPIT
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