发明名称 METHOD AND APPARATUS FOR EVALUATING BONDED STRENGTH
摘要 A method and an apparatus for evaluating bonded strength are provided to estimate the bonded strength of bonded plates itself and to apply a load to the large diameter bonded plates uniformly. An apparatus for evaluating bonded strength comprises a first unit(200) connected to one side of an object which is made up by welding, a second unit(300) connected to the other side of the object, and a measuring unit connected to the first unit or/and the second unit. At least one of the sides connected to the first and the second unit is equal to or greater than the size of the object. The first and the second unit are composed of top parts(220,320) and bottom parts(210,310) combined with each other.
申请公布号 KR20090059804(A) 申请公布日期 2009.06.11
申请号 KR20070126853 申请日期 2007.12.07
申请人 SILTRON INC. 发明人 KIM, IN KYUM;YUK, HYUNG SANG;HUH, YONG HAK
分类号 G01N19/04;G01N19/00 主分类号 G01N19/04
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