ELECTRONIC CHIP COMPONENT, AND MOUNTING METHOD FOR ELECTRONIC CHIP COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic chip component capable of reducing occurrence of a Manhattan phenomenon as much as possible.

SOLUTION: The electronic chip component 10 has end electrodes 14 formed on both end sides of a main component body 12 in a cubic or rectangular parallelepiped shape, a dummy terminal 16 to be soldered to a dummy land part 20 of a mounting board 18 being formed over a ridge and/or a side surface of the component body 12 separately from the end electrodes 14.

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