发明名称 METHOD AND DEVICE FOR CUTTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a high quality and highly reliable product 5 when cutting a molded substrate 1 to form a package (product) 5, and to efficiently improve the productivity of the product 5. SOLUTION: First, individual package 5 (1c) which is fastened by a first package fastening mechanism 11 is transferred to a package placement surface (upper surface) 12a of a reverse locking plate 12, and the reverse locking plate 12 is reversed to make the package placement surface 12a an lower surface side. Inspection is performed by a first inspection mechanism 13 from a lower position. Next, a first inspected package 5 (1c) on the reverse locking plate 12 is inherited and transferred to a package placement surface 14a of the placement plate 14, and the first inspected package 5 (1c) is inspected by a second inspection mechanism 15 from an upper position. Then, a second inspected package 5 (1c) is transferred to a placement table 17 at a package placement position 18a by a second package fastening mechanism 16. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009130342(A) 申请公布日期 2009.06.11
申请号 JP20070307391 申请日期 2007.11.28
申请人 TOWA CORP 发明人 IWATA YASUHIRO;YAMAJI SHUZO;NAKAJIMA SHINYA;KASHIWAMURA JUNKO;MORISAWA TADASHI
分类号 H01L21/56;H01L23/12 主分类号 H01L21/56
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