发明名称 FLEXIBLE PRINTED WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To improve transmission loss which is a problem in a high-frequency zone signal transmission line by a differential transmission system including a ground layer coated with a conductive paste. SOLUTION: The flexible printed wiring board 1A includes: a signal layer 20 embedded between a base layer 10 and a cover layer 30; and a metal spatter film 33 coated with the cover layer 30 while covering the signal layer 20. A grand line 21 is conductively joined in a spot manner to the metal spatter film 33 via an opening (CH). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009130265(A) 申请公布日期 2009.06.11
申请号 JP20070306013 申请日期 2007.11.27
申请人 TOSHIBA CORP 发明人 MURO SEIDAIBI;HAPPOYA AKIHIKO
分类号 H05K1/02;H05K1/03 主分类号 H05K1/02
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