发明名称 CLEAN ROOM, FILM FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a clean room reduced in the characteristic dispersion of a semiconductor device to be manufactured. SOLUTION: A vacuum chamber is set in a room filled with gas having no unfavorable effect on a semiconductor film so as to prevent an oxygen gas or a nitrogen gas of an atmospheric component from entering a vacuum chamber from the outside of the vacuum chamber. The gas having no unfavorable effect on the semiconductor film is a rare gas or hydrogen. According to such a clean room structure, an oxygen concentration, a nitrogen concentration and a moisture concentration around a manufacturing device in the room can be minimized as much as possible. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009127981(A) 申请公布日期 2009.06.11
申请号 JP20070305964 申请日期 2007.11.27
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;ARAI YASUYUKI;FURUNO MAKOTO
分类号 F24F7/06;H01L21/205;H01L21/336;H01L29/786 主分类号 F24F7/06
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