发明名称 |
CLEAN ROOM, FILM FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a clean room reduced in the characteristic dispersion of a semiconductor device to be manufactured. SOLUTION: A vacuum chamber is set in a room filled with gas having no unfavorable effect on a semiconductor film so as to prevent an oxygen gas or a nitrogen gas of an atmospheric component from entering a vacuum chamber from the outside of the vacuum chamber. The gas having no unfavorable effect on the semiconductor film is a rare gas or hydrogen. According to such a clean room structure, an oxygen concentration, a nitrogen concentration and a moisture concentration around a manufacturing device in the room can be minimized as much as possible. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009127981(A) |
申请公布日期 |
2009.06.11 |
申请号 |
JP20070305964 |
申请日期 |
2007.11.27 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YAMAZAKI SHUNPEI;ARAI YASUYUKI;FURUNO MAKOTO |
分类号 |
F24F7/06;H01L21/205;H01L21/336;H01L29/786 |
主分类号 |
F24F7/06 |
代理机构 |
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代理人 |
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