PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND ATOMIC CLOCK

摘要

A piezoelectric vibrator manufacturing method is provided with a cavity forming step of forming a recessed section for a cavity on at least one of two wafers; a bonding electrode film forming step of forming a bonding electrode film on bonding surfaces of the both wafers; a mount pattern forming step of forming a pair of mount patterns in the cavity; a through hole forming step of forming a pair of through holes in the cavity; a penetrating electrode forming step of forming, in the cavity, a pair of penetrating electrodes electrically connected with the patterns; a mounting step of electrically connecting the patterns and a piezoelectric vibration piece with each other; an overlapping step of storing a getter material by overlapping the both wafers with each other; a bonding step of manufacturing a wafer body by anodically bonding the both wafers; a gettering step of adjusting vacuum degree in the cavity, while measuring a series resonant resistance value; and a cutting step of cutting the wafer body into individual pieces.