PROBE CONTACT FOR BGA PACKAGE TEST SOCKET AND BGA PACKAGE TEST SOCKET INCLUDING THE SAME

摘要

A probe contact for a BGA(Ball Grid Array) package test socket and a BGA package test socket including the same are provided to maintain a low inductance structure for a high frequency response by minimizing damage to an external contact ball of a BGA package. A probe contact for a BGA package test socket electrically connects a BGA package ball to an electrode of a test board. A part contacted with the BGA package ball of the probe contact is made of conductive elastic member. The conductive elastic member is a resin elastic body or a conductive rubber in which a conductive metal is dispersed. The probe contact for a BGA package test socket includes a top plunger, a bottom plunger, and an elastic member. The elastic member is inserted between the top plunger and the bottom plunger.