发明名称 PROTECTIVE FILM FOR LASER PROCESSING AND PROCESSING METHOD USING THE SAME
摘要 <p>Disclosed is a protective film for laser processing, which has high adhesiveness and is capable of protecting an object to be processed with a uniform thickness, while being prevented from carbonization/adhesion due to thickness variations. In addition, this protective film for laser processing is free from the problem of waste water contamination when it is removed. Also disclosed is a laser processing method using such a protective film. Specifically disclosed is a protective film for laser processing, which contains a (meth)acrylate copolymer and a radiation-polymerizable (meth)acrylate having an unsaturated bond.</p>
申请公布号 WO2009072538(A1) 申请公布日期 2009.06.11
申请号 WO2008JP72010 申请日期 2008.12.04
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA;TAKESUE, HIRONORI;TAGUCHI, KOICHI 发明人 TAKESUE, HIRONORI;TAGUCHI, KOICHI
分类号 H01L21/301;C08L33/04;B23K26/16;B23K26/18;C08F2/44 主分类号 H01L21/301
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