| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is miniaturizable, and to provide a method of insulating the semiconductor device. <P>SOLUTION: The semiconductor device in which a semiconductor module 3 having a semiconductor chip joined to a bus bar in a resin frame 30 is coupled to a cooler 5 across an insulator 4 with screws 2 has an insulator 6 charged inside and outside the resin frame. Consequently, an insulator is charged between the resin frame 30 and the insulator to prevent a surface discharge between an exposed surface of the bus bar of the semiconductor module and a screws 2. The creepage distance between the bus bar and screw need not be secured, so that the semiconductor module is miniaturizable. Further, the cooler includes an outflow prevention wall 5a to prevent the insulator from flowing out when charged inside and outside the semiconductor module 3, thereby charging the insulator between the exposed surface of the bus bar of the semiconductor module and the screws without any gap. Accordingly, insulating performance by the insulator can be made contact inside and outside the semiconductor module. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
