| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board having improved interlayer connection reliability, and to provide a method of manufacturing the multilayer printed circuit board. <P>SOLUTION: In the multilayer printed circuit board 10, a plurality of first resin films 15, having a through-hole 11, a conductor pattern 12 formed on both the surfaces, and a conductive through-hole 14 integrally formed with the conductor pattern 12 on the inner wall of the through-hole, and a second resin film 22 that has a via hole 21 and does not have any conductor patterns on both the surfaces overlap mutually. Conductive paste 23 filled into the via hole 21 is subjected to intermetallic combination with two conductor patterns 12 opposing between two adjacent first resin films 15. The conductor patterns 12 on both the surfaces of each resin film 15 are electrically connected by the conductive through-hole 14, and two conductor patterns 12 opposing between the two adjacent first resin films 15 are electrically connected by the conductive paste 23. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
