| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of polishing a semiconductor wafer, which polishes the wafer without deteriorating other polishing characteristics by reliably and efficiently reducing a content of metal penetrating into the wafer, which is to be reduced from a polishing liquid. <P>SOLUTION: In the method of polishing the semiconductor wafer, a surface of the semiconductor wafer is polished using the polishing liquid. The polishing liquid is retained in a filter, which is composed of a fiber having a metal selectively adsorbing material fixed thereon, for one to thirty minutes, and then the surface of the semiconductor wafer is polished using the processed polishing liquid in 0.5 to 24 hours. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
