发明名称 COOLING APPARATUS FOR ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a heat receiving member for improving a cooling performance and which is small and which is simple in structure, as a cooling apparatus for electronic equipment. SOLUTION: A heat reception member is formed by a heat-receiving base body which has a plate shape by a metal material with superior heat conductivity, and which is integrally formed with a fin configuring a flowing path of a cooling medium in a flat surface on an opposite side of a flat surface thermally connected to a heating body; and a heat receiving case body, formed integrally with a plurality of attachment parts vertically overhanging in a flange shape to a side surface at a lower end part of the side surface. The heat-receiving member is held so as to oppose the heating body of an electronic equipment and is pressed against the heating body by elastic deformation, in the attachment part of the heat receiving base body and the heat receiving case body and thermal connection is carried out. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009130224(A) 申请公布日期 2009.06.11
申请号 JP20070305200 申请日期 2007.11.27
申请人 HITACHI LTD 发明人 OGIJI KENJI;MASUOKA NOBUO;TOIZONO TAKESHI;SHIODE KENICHI
分类号 H01L23/473;H01L23/40;H05K7/20 主分类号 H01L23/473
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