发明名称 INJECTION MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a low-cost injection molding device featuring a short molding cycle. SOLUTION: This injection molding device includes a mold 1, a mold clamping means 30 for clamping the mold 1, an injection means 12 which fills the interior of the mold 1 with a molten resin by injection, pressure detection means 7 and 8 which measure the resin pressure inside the mold 1, and a mold clamping/release control means 34 which releases the mold 1 from its clamping state when the resin pressure reaches a pressure value set based on the peak value, in filling the interior of the clamped mold 1 with a molten resin by injection. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009126093(A) 申请公布日期 2009.06.11
申请号 JP20070304681 申请日期 2007.11.26
申请人 AISIN SEIKI CO LTD 发明人 KASAHARA HIDEYA;HAYASHI NAOTAKA
分类号 B29C45/77 主分类号 B29C45/77
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