| 发明名称 |
LIQUID JET-GUIDED ETCHING METHOD FOR REMOVING MATERIAL FROM SOLIDS AND ALSO USE THEREOF |
| 摘要 |
The present invention relates to a method for removing material from solids by liquid jet-guided etching. The method according to the invention is used in particular for cutting, microstructuring, doping of wafers or also the metallisation thereof.
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| 申请公布号 |
US2009145880(A1) |
申请公布日期 |
2009.06.11 |
| 申请号 |
US20080346113 |
申请日期 |
2008.12.30 |
| 申请人 |
MAYER KUNO;KOLBESEN BERND O |
发明人 |
MAYER KUNO;KOLBESEN BERND O. |
| 分类号 |
B44C1/22 |
主分类号 |
B44C1/22 |
| 代理机构 |
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