| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipater which can reduce the manufacturing cost and can relax thermal stress due to heat generation from a heat element while suppressing increase in thermal resistance. <P>SOLUTION: An insulating substrate 10 has a metal circuit layer 11 formed on the side of a heating element mounting surface, and a metal layer 12 consisting of aluminum formed on the side of the other surface. A heat sink 40 consists of aluminum and serves as a liquid-type cooler with a cooling channel therein. A heat mass member 30 consisting of aluminum is metal bonded between the metal layer 12 of the insulating substrate 10 and the heat sink 40. The heat mass member 30 has a stress relax portion 31 and a heat mass portion 32 in the thickness direction thereof. The stress relax portion 31 is a region where a plurality of recesses 31a are formed in the surface of the heat mass member 30 on the side of the insulating substrate 10. The heat mass portion 32 has a thickness t2 which is thicker than that of the stress relax portion 31, and the heat mass member 30 has a thickness t3 of >3 mm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
