发明名称 SUBSTRATE POSITIONING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate positioning apparatus for reducing dust generation in positioning the substrate, actualizing accurate positioning without damage on the substrate even if it is thin, and also reducing the manufacturing cost. SOLUTION: The substrate positioning apparatus 1 includes a turning member 10 having a holding plane 11 for holding a circular substrate W and turning around an axis, a correcting member 40 arranged in the circumference of the holding plane 11 with an annular correcting plane 41 opposed to the backside of the circular substrate W, and guiding members 30, 30 for holding the circular substrate W from the flat plane width direction, wherein the turning member 10 includes a ventilating hole 13 for taking or blowing out the compressed air (gas) from the holding plane 11, while the correcting member 40 is provided, between the backside of the circular substrate W and the correcting plane 41, with a ventilating hole 45 for correction for blowing out the compressed air toward the external circumferential side from the internal circumferential side of the correcting plane 41. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009130011(A) 申请公布日期 2009.06.11
申请号 JP20070301227 申请日期 2007.11.21
申请人 ATEL CORP 发明人 MITSUYOSHI TOSHIHIKO
分类号 H01L21/68;H01L21/027 主分类号 H01L21/68
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