| 摘要 |
PROBLEM TO BE SOLVED: To detect the position at the outer circumferential end of a wafer accurately with a linear scan camera having a relatively small imaging range even if a wafer to which a film is stuck has a warp or an error in the conveyance position. SOLUTION: An aligner apparatus 10 is provided with a linear scan camera 2, a displacement sensor 6, a camming follow-up mechanism 3, and an eccentricity follow-up mechanism 4. During one revolution of a wafer W, the camming follow-up mechanism 3 is operated such that the outer circumferential end of the wafer W is located within the depth of field of the linear scan camera 2 based on the detection result by the displacement sensor 6, and the eccentricity follow-up mechanism 4 is operated such that the outer circumferential end of the wafer W is located within the imaging range of the linear scan camera 2 based on the image data by the linear scan camera 2. The linear scan camera 2 is moved in the vertical direction and the horizontal direction relative to the wafer W while following up the position at the outer circumferential end of the wafer W in the vertical direction and the horizontal direction during rotation of the wafer W. COPYRIGHT: (C)2009,JPO&INPIT |
