发明名称 INTEGRATED CIRCUIT SYSTEM EMPLOYING DIFFUSED SOURCE/DRAIN EXTENSIONS
摘要 <p>An integrated circuit system is provided to form an activated source/drain extension region without an ion implantation of a source/drain extension region. An NFET device(102) and a PFET device(104) are formed on a substrate. An insulation layer is formed on the NFET device, the PFET device, and the substrate. A source/drain extension region is formed between an edge of the PFET gate and the doped epitaxial layer by applying an energy source to a doped epitaxial layer(500). A mask layer is formed on the PFET device and an insulation layer. Before forming an electrical contact, the mask layer is removed on the PFET device, an NFET cap is selectively removed on the NFET gate. A fist dielectric(902) is deposited on the NFET device.</p>
申请公布号 KR20090060165(A) 申请公布日期 2009.06.11
申请号 KR20080122071 申请日期 2008.12.03
申请人 SAMSUNG ELECTRONICS CO., LTD.;INTERNATIONAL BUSINESS MACHINES CORPORATION;CHARTERED SEMICONDUCTOR MANUFACTURING LTD.;INFINEON TECHNOLOGIES AG 发明人 CHOI, HYUNG YOON;GLUSCHENKOV OLEG;HAN JIN PING;LIU JIN PING;LAI CHUNG WOH;TEO LEE WEE;LOESING RAINER;MADAN ANITA;UTOMO HENRY K.
分类号 H01L29/78;H01L21/324;H01L21/336 主分类号 H01L29/78
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