| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of enhancing the reliability by reducing the noise, and also capable of improving the productivity. <P>SOLUTION: The semiconductor device 50 includes: a semiconductor chip 20 and a semiconductor chip 30 each containing a transistor element; a metal header 2 on which the semiconductor chip 20 is fixed on the top face thereof and a metal header 3 on which the semiconductor chip 30 is fixed on the top face thereof, wherein the semiconductor chips 20 and 30 are distant from each other by a predetermined distance; a seal 40 composed of an insulating resin material for sealing over all faces of the metal headers 2 and 3 together with the semiconductor chips 20 and 30; and 6 lead terminals 10 delivered from one terminal face 40a of the seal 40 to the outside as being extended in the same direction, wherein the semiconductor chip 20 and the semiconductor chip 30 are electrically-connected to each other through a wire 8 composed of an Al wire in the inside of the seal 40. <P>COPYRIGHT: (C)2009,JPO&INPIT |
