| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device capable of increasing heat dissipation and dispensing with a flux cleaning step. <P>SOLUTION: A chip mounting step is performed to perform the eutectic junction of an LED chip 10 to a submount member 30 (Fig.1(a)), and then a submount mounting step is performed to perform the eutectic junction of the submount member 30 to a heat transfer plate 21 (Fig.1(b)). Then, a wiring board sticking step is performed to stick a wiring board 22 to one surface side of the heat transfer plate 21 (Fig.1(c)), a wire-bonding step is performed to connect the LED chip 10 to wiring patterns 23, 23 of the wiring board 22 via bonding wires 14, 14, a resin injection step is performed to inject a liquid-like sealing resin 50a that becomes one portion of a sealing section 50 (Fig.1(d)), an optical member sticking step is performed to stick an optical member 60 to the wiring board 22, and a color conversion member sticking step is performed to stick a color conversion member 70 to the wiring board 22 (Fig.1(f)). <P>COPYRIGHT: (C)2009,JPO&INPIT |
