| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent burrs from being formed at a molding step and to prevent the transmittance from being deteriorated when solder reflow treatment is performed. <P>SOLUTION: A method for manufacturing an image pickup apparatus 100 comprises: a viscosity increasing step of increasing the viscosity of an energy-curable resin composition comprising first and second polymerization initiators to the predetermined viscosity by performing the first treatment that a polymerization reaction using the first polymerization initiator is caused so as to make the content of the second polymerization initiator higher than that of the first polymerization initiator; the molding step of molding an image pickup lens 16 by performing the second treatment that the resin composition whose viscosity is increased at the viscosity increasing step is packed in a molding die and the polymerization reaction using the second polymerization initiator is caused to cure the resin composition; a placing step of placing the image pickup lens 16 on a circuit board 1 together with a sub-substrate 10; and a mounting step of mounting the image pickup lens 16 and the sub-substrate 10 on the circuit board 1 by subjecting the image pickup lens 16, the sub-substrate 10 and the circuit board 1 to the solder reflow treatment. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
