发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To solve the problem that although an electronic tag is generally configured by loading an RFID chip on an antenna, the RFID chip is loaded on the antenna, and there is possibility that the RFID chip is peeled due to an external force even when it is fixed with sealing resin, and that although the RFID chip is protected from the external force by using a resin film such as a PET film having a hole as a carrier tape to manufacture the electronic tag so that the RFID chip is positioned at the hole, the hole is relatively small, and highly precise positioning is required for arranging the RFID chip. <P>SOLUTION: When attaching individualized inlets for an electronic tag to a tape, the delivery of the tape to its mounting position is carried out by roller conveyance, and the position is image-recognized, and correction conveyance is carried out by a roller again, so that the attaching position is accurately secured. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009129217(A) 申请公布日期 2009.06.11
申请号 JP20070303954 申请日期 2007.11.26
申请人 RENESAS TECHNOLOGY CORP 发明人 ISHIZAWA HARUHIKO
分类号 G06K19/077;G06K19/07;H01Q1/38 主分类号 G06K19/077
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