| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a circuit board, which performs an etching process and a cleaning process, and further can clean an organic substance on a surface of a semiconductor wafer or can perform a reforming process by a single apparatus. SOLUTION: The apparatus for manufacturing the circuit board comprises: a fluid injection mechanism 24 for injecting various chemical solutions or cleaning solutions together with a nitrogen gas onto a process face of a semiconductor wafer 20; an ultraviolet rays irradiation lamp 30 for emitting ultraviolet rays onto the process face; an inside tank 32 which has an upper part which can be vertically separated, a lower part which is fixed to a rotor 12, and a side part having a fluid extracting opening 38; an outside tank 40 having an upper part which can be vertically separated; a lifting mechanism 56 for lifting up each upper part of the inside tank 32 and the outside tank 40 upward; and a vacuum pump 58 for reducing a pressure of a space between the inside tank 32 and the outside tank 40. The fluid injection mechanism 24 and the ultraviolet rays irradiation lamp 30 are connected to a switching hollow rotary shaft 62 having a rotary axis at a position different from a rotary axis of a hollow rotary shaft 14. COPYRIGHT: (C)2009,JPO&INPIT
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