| 摘要 |
A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting portion, which has a continuous oblong shape. A space portion is provided between the first pad portion and the second pad portion, and the lead connecting portion includes a non-connected region located at a corresponding position of the space portion.
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