发明名称 PHOTO CURABLE RESIN COMPOSITION FOR PAD PROTECTIVE LAYER, AND METHOD FOR MANUFACTURING IMAGE SENSOR USING THE SAME
摘要 <p>A photocurable resin composition is provided to manufacture an image sensor without a lower part over coating film due to excellent pattern formation property and chemical resistance and to reduce the generation of cross talk and the degradation of photosensitivity even if a pixel size of the image sensor is reduced. A photocurable resin composition for forming a pad protective layer comprises alkali soluble resin, a reactive unsaturated compound, a photoinitiator and solvent. The alkali soluble resin is a copolymer comprising a component represented by chemical formula 1 of 5 ~ 50 weight%; a component represented by chemical formula 2 of 1 ~ 25 weight%; and a component represented by chemical formula 3 of 45 ~ 90 weight%. In chemical formula 1, R11 ~ R13 are selected from the group consisting of hydrogen atom, substituted or unsubstituted alkyl group, substituted or unsubstituted cycloalkyl group, substituted or unsubstituted aryl group, and substituted or unsubstituted heteroaryl group.</p>
申请公布号 KR20090059965(A) 申请公布日期 2009.06.11
申请号 KR20070127078 申请日期 2007.12.07
申请人 CHEIL INDUSTRIES INC. 发明人 LEE, KIL SUNG;KIM, JAE HYUN;LEE, CHANG MIN;JEONG, EUI JUNE;HAN, KWEN WOO;KWON, O BUM;CHOI, JUNG SIK;KIM, JONG SEOB;CHANG, TU WON;CHO, JUNG HYUN;JEONG, SEUL YOUNG
分类号 G03F7/004;H01L27/146 主分类号 G03F7/004
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