| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing resin from not being filled, attaining high heat dissipation and improving the reliability, while making the production efficiency maintained, and to provide its manufacturing method and a manufacturing method of a lead frame. <P>SOLUTION: The lead frame 15 comprises a die pad 11, having the same shape as that of an external terminal and being folded, to expose on the rear face of the semiconductor device to serve as a mounting region of a semiconductor element 4, and a lead 3 which includes an outer lead 3o which serves as the external terminal and an inner lead 3i, formed integrally with the outer lead 3o. <P>COPYRIGHT: (C)2009,JPO&INPIT |
