| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition that is low in viscosity when remelted and can prevent deformation, etc. of bonding wires; a semiconductor device sealed with the liquid sealing resin composition hardened; and a method for manufacturing the semiconductor device, including a process by which semiconductor packages or the like having bonding wires are sealed together using the liquid sealing resin composition. SOLUTION: The liquid sealing resin composition includes an epoxy resin which is solid at room temperature and which has a softening point of 80°C or below; a curing agent; a filler; and a solvent. The semiconductor device includes a first semiconductor element disposed on one side of a first substrate, a bonding wire for electrically connecting the first semiconductor element to the first substrate, and a second semiconductor element disposed on the side of the first semiconductor element opposite to the first substrate. The liquid sealing resin composition is used to seal between the first semiconductor element and the second semiconductor element of the semiconductor device while heated to temperatures not lower than the softening point of the epoxy resin. COPYRIGHT: (C)2009,JPO&INPIT
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