发明名称 FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a film deposition system where the feeding state of a film deposition gas is stabilized in film deposition treatment utilizing catalyst lines. SOLUTION: The film deposition system comprises: a first stage holding a pair of substrates S in a state of being erected and allowing the respective substrates S to face each other; a plurality of catalyst lines 15 arranged at a gap (reaction space) between the respective substrates S; and a gas feed part 20 feeding a film deposition gas to the reaction space. The gas feed part 20 comprises: a plurality of nozzles N1 arranged at the outside of the reaction space and elongating along the facial directions of the substrates S; and shielding pieces 22a surrounding the openings of the respective nozzles N1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009127100(A) 申请公布日期 2009.06.11
申请号 JP20070304398 申请日期 2007.11.26
申请人 ULVAC JAPAN LTD 发明人 NISHIKATA YASUSHI;OSONO SHUJI;ASARI SHIN;SAITO KAZUYA;OGATA HIDEYUKI;OKAYAMA TOMOHIKO
分类号 C23C16/44;H01L21/205;H01L21/31 主分类号 C23C16/44
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