| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition having excellent storage stability, adhesiveness, solder heat resistance, and workability, and to provide an adhesive sheet and a cover-lay film using the adhesive composition. SOLUTION: The adhesive composition includes 100 pts.mass of an epoxy resin A, 5-200 pts.mass of a carboxyl group-containing acrylonitrile-butadiene rubber B, 1-80 pts.mass of an amine-based curing agent C, 0.1-10 pts.mass of a fluoboric curing accelerator D, and an inorganic filler E. The content of the inorganic filler E is 5-100 mass% based on the total of the components A-D. When the number of moles of the component C and that of the component D contained in the adhesive composition are represented by m<SB>1</SB>and m<SB>2</SB>individually, a ratio m<SB>1</SB>/m<SB>2</SB>between them is 5-20. The adhesive sheet has a layer consisting of the adhesive composition, and a die releasing base material layer covering the layer consisting of the adhesive composition. The cover-lay film includes an electric insulation film, and a layer arranged on the electric insulation film and formed of the adhesive composition. COPYRIGHT: (C)2009,JPO&INPIT
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