发明名称 THIN SHEET MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thin sheet manufacturing method which can be suitably used for manufacturing a high quality thin sheet without the decrease of the manufacturing amount of the thin sheet, by accurately controlling the depth of the dipping of a ground sheet into a molten liquid. SOLUTION: In the thin sheet manufacturing method, a planar surface layer part of the ground sheet 10 is dipped into a silicon molten liquid 1002 and the thin sheet is manufactured by solidifying the silicon on the surface layer part. In the thin sheet manufacturing method, the silicon molten liquid 1002 and the ground sheet 10 are included in an electric circuit, and when the silicon molten liquid 1002 comes in contact with the ground sheet 10, an electrical signal variation between the ground sheet 10 and the silicon molten liquid 1002 is caused. A position of the ground sheet 10 when the ground sheet 10 comes in contact with the liquid surface of the silicon molten liquid 1002 is detected by detecting the electrical signal variation. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009126767(A) 申请公布日期 2009.06.11
申请号 JP20070306123 申请日期 2007.11.27
申请人 SHARP CORP 发明人 KOMA SHUJI;IGARASHI KAZUTO;YOSHIDA KOJI
分类号 C30B28/04;B22D23/04;B22D25/02;C01B33/02 主分类号 C30B28/04
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