| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with a die attach film, in which the semiconductor device which is secured in cutting quality of the die attach film, can be manufactured easily and at a low cost. SOLUTION: In a die attach layer transfer stage of transferring a die attach layer to each semiconductor element 1d as an individual piece, a resin film 4 serving as the die attach layer is formed on a transfer surface 21a of a transfer roller 21, the resin film 4 transferred by pressing the transfer roller 21 having the resin film 4 formed, against a die 26 is divided into individual piece films 4* corresponding to an array pattern of semiconductor elements 1d, and the individual films 4* are transferred to the respective semiconductor elements 1d by rolling the transfer roller 21 on the backside of the semiconductor wafer 1. Consequently, deficiencies in conventional methods are eliminated, and the semiconductor device which is secured in the cutting quality of the die attach film is manufactured in the easy and inexpensive method. COPYRIGHT: (C)2009,JPO&INPIT |
