| 摘要 |
The invention relates to an electrical circuit arrangement, having a substrate (16) and at least two conductive surfaces (10, 11, 12, 13). The substrate (16) comprises at least one layer. At least one layer of the substrate (16) is located between the at least two conductive surfaces (10, 11, 12, 13). The at least two conductive surfaces (10, 11, 12, 13) form a capacity. The conductive surfaces (10, 11, 12, 13) partially overlap and form an overlap surface. The resulting overlap surface remains extensively constant when the conductive surfaces (10, 11, 12, 13) are displaced up to a limit value of displacement. |
