发明名称 THROUGH-WAFER INTERCONNECTIONS IN ELECTROSTATIC TRANSDUCER AND ARRAY
摘要 A method for fabricating electrostatic transducers and arrays electrically separates the substrate segments of the transducer elements from each other using a technique involving two cutting steps, in which the first step forms a patterned opening in the substrate to make a partial separation of substrate segments, and the second step completes the separation after the substrate segments have been secured to prevent instability of the substrate segments upon completion of the second step. The securing of the substrate segments may be accomplished by filling a nonconductive material in the partial separation or securing the transducer array on a support substrate. When the substrate is conductive, the separated substrate segments serve as separate bottom electrodes that can be individually addressed. The method is especially useful for fabricating ID transducer arrays.
申请公布号 WO2009073706(A1) 申请公布日期 2009.06.11
申请号 WO2008US85374 申请日期 2008.12.03
申请人 KOLO TECHNOLOGIES, INC.;HUANG, YONGLI 发明人 HUANG, YONGLI
分类号 H01L21/00 主分类号 H01L21/00
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