VACUUM PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

Disclosed is a vacuum processing apparatus (1) wherein a plurality of processing chambers for performing prescribed process to substrates (S) to be processed are connected in series. The vacuum processing apparatus (1) is provided with a first substrate transfer path (15) between the processing chambers of the vacuum processing apparatus, and a second substrate transfer path (16), which is arranged in parallel to the first substrate transfer path (15) for transferring the substrates and permits the prescribed process to be performed in each processing chamber. At least in two of the processing chambers, a transfer path changing means (17) is arranged for shifting the substrate between the first substrate transfer path and the second substrate transfer path.