| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which promises high reliability of electrical characteristics compared with a conventional art regardless of difference between a thermal expansion amount of a semiconductor element and that of a circuit board. <P>SOLUTION: A semiconductor element 101 with a projection electrode 103 is arranged on a circuit board 104 with a projection electrode 106. A distance between the semiconductor element 101 and the circuit board 104 which contact through a spacer 109 is determined. A gap between the projection electrodes 103 and 106 opposed to each other is formed. A conductive elastic body 108 is interposed in the gap. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
