| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of being connected by solder in a brief time. <P>SOLUTION: The multilayer wiring board, in which a predetermined wiring pattern is formed in a surface layer and inner layer and the surface layer includes: a plurality of electronic parts, comprising a grounding electrode part 12 for connecting a grounding side terminal 42 of an electrolytic capacitor 4 and a surface layer side grounding pattern 61; a slit part 2 configured by cutting out part of the surface layer side grounding pattern 61 in the vicinity of the grounding electrode part 12; and a through-hole 3 that connects the surface layer side grounding pattern 61 and an inner layer side grounding pattern 62 provided in the inner layer between the grounding electrode part 12 and the slit part 2. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
