| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method capable of preventing characteristics from varying between semiconductor chips, achieving a low height, reducing a cost, and improving reliability. SOLUTION: This semiconductor device is equipped with a substrate 10, a terminal 12 provided in the substrate 10, a unit 40 formed by bonding a controller chip 30 to a memory chip 20 by flip chip bonding so as not to overlap with a terminal 22 provided in the memory chip 20, and a bonding wire 24 to electrically connect the terminal 12 to the terminal 22. Its manufacturing method is also provided. COPYRIGHT: (C)2009,JPO&INPIT
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