| 摘要 |
<p>Disclosed are a camera module, which is advantageous for relaxing the stress to be applied to a connector or a flexible substrate when a printed circuit board is mounted, and an electronic device. A lens mount (22) has a first side face (44) and a second side face (46) intersecting each other. An imaging element (26) is mounted to have its back face (26A) directed to a flexible substrate (28). A signal processing unit (30) is mounted on a rigid printed circuit board (32). The flexible substrate (28) has a protruding portion (50) protruding from an intersecting portion (48), at which the first side face (44) and the second side face (46) intersect. The printed circuit board (32) is arranged on the second side face (46) through a tack mechanism (54), and the protruding portion (50) of the flexible substrate (28) is folded at the intersecting portion (48) so that a flexible substrate side connector (52) is joined to a printed circuit board side connector (56) and so that an adhesive layer (58) is adhered to the second side face (46). Thus, the flexible substrate (28) and the printed circuit board (32) are arranged in the lens mount (22).</p> |
